Foldable Screen Smartphones
Specifically developed for large foldable screen smartphones, this material helps reduce overall weight while improving thermal conductivity.
It is the only material currently applied in the 3C smartphone industry with such performance advantages.
It can replace AZ91D magnesium alloy die-casting components that suffer from thermal conductivity limitations, providing better heat dissipation performance and enhanced product reliability.
Performance Parameters Specific Indicator
Yield Strength ≥170 MPa
Tensile Strength ≥270 MPa
Elongation ≥10%
Hardness ≥65 HV
Thermal Conductivity ≥100 W/m·K
Electrical Conductivity ≥14 MS/m
Shrinkage Rate 5.8‰
Density 17.5~2.05 g/cm³